Taiwan Semiconductor Manufacturing Company
At a glance
TSMC is the world's leading dedicated semiconductor foundry, manufacturing advanced chips for AI, high-performance computing and smartphone customers and providing CoWoS advanced packaging. 9% gross margin. 1B, and 2nm reached 8% of wafer revenue.
- 66 sourced links show other companies and organisations relying on Taiwan Semiconductor Manufacturing Company.
- 60 of 70 recorded relationships carry a cited source (86%).
- 4 documented changes to its relationships in the last 90 days, against 1 in the 90 days before.
- Invests in 5 other companies on record.
- 2 named competitors on record.
- Importance (our rating)
- Critical
- Relationships sourced
- 86%
- Evidence strength
- 63/100
- Activity (90 days)
- Accelerating
The share of relationships with a source, adjusted for how recent and how primary those sources are — so it sits below the plain sourced share.
Opportunities (our analysis)
Risks (our analysis)
Most important dependencies
Analyst Brief
Executive Summary ↗ · Full Analyst Report ↗Figures researched 2026-10-26 · market data Oct 28, 2026 (delayed). Not investment advice.
- Customer concentration: Largest single customer: 19% of revenue; aggregate disclosed: 78% — "TSMC's 2025 Form 20-F annual report discloses that its largest customer accounted for approximately 19% of 2025 net revenue, its second-largest customer approxima" (TSMC FY2025 20-F discloses customer revenue concentration).
- Guidance track record: beat its own guidance midpoint in 4 of 4 scored periods (average +2.4%).
- United States exposure: Amkor Technology, Applied Materials, Cadence Design Systems — rated Critical or Very High for Taiwan Semiconductor Manufacturing Company — are headquartered in United States, along with 14 other known suppliers (Lam Research, FormFactor, KLA Corporation). 100 other companies and organisations rely on the same United States-based suppliers, so a disruption there would hit Taiwan Semiconductor Manufacturing Company's peers and customers at the same time — substitution would be competed for, not simply available.
- Next catalysts: Nov 10, 2026 — October 2026 monthly sales; Dec 10, 2026 — November 2026 monthly sales; Jan 8, 2027 — December 2026 monthly sales
Financial Snapshot
Reported figures from Taiwan Semiconductor Manufacturing Company's cited filings, plus live valuation (Yahoo Finance, delayed). Not investment advice.
Revenue (approx., as stated on call) (FY2025)
TWD 3.80T
+32% YoY
Gross margin (FY2025)
60%
Operating margin (FY2025)
51%
Diluted EPS (FY2025)
TWD 66.25 / share
+46% YoY
Free cash flow (approx.) (FY2025)
TWD 1.00T
+15% YoY
Cash dividends paid (FY2025)
TWD 467.0B
+29% YoY
Net cash
TWD 3.20T
cash TWD 4.02T · debt TWD 818.4B
P/E
28.3×
forward 18.7×
4-year trend · as reported · TWD
| Fiscal year ended | Dec 2022 | Dec 2023 | Dec 2024 | Dec 2025 |
|---|---|---|---|---|
| Revenue | TWD 2.26T | TWD 2.16T | TWD 2.89T | TWD 3.81T |
| Revenue growth | — | -4.5% | +34% | +32% |
| Operating margin | 50% | 43% | 46% | 51% |
| Diluted EPS | TWD 196.00 | TWD 161.70 | TWD 226.25 | TWD 327.35 |
| Free cash flow | TWD 521.0B | TWD 286.6B | TWD 861.2B | TWD 992.4B |
Source: company filings via Yahoo Finance. Full history in the Analyst Report.
Guidance (4Q26 and FY2026): 4Q26 revenue expected at US$52.3-54.3 billion, gross margin 65-67% and operating margin 56.5-58.5%, assuming US$1 = NT$31.8. Full-year 2026 revenue growth now expected around 44% in US dollar terms; 2026 capital budget reiterated at US$60-64 billion (raised from the US$52-56 billion set in January). [TSMC (SEC Form 6-K earnings release)]
Consensus: Analysts expect TWD 1.71T of revenue this quarter (26 analysts), +63% on a year earlier. This fiscal year's EPS estimate is $17.50 (+64%), up 4.8% over 90 days. Reported EPS beat the consensus in 4 of the last 4 quarters (average +5.7%). Provider compilation of analyst estimates (Yahoo Finance) — market context, not an InsightNodes forecast.
Credit: Rated AA- (positive) by S&P Global Ratings, Aa2 (positive) by Moody's, twAAA (stable) by Taiwan Ratings (S&P subsidiary in Taiwan); net cash of TWD 2.06T (fiscal year ended Dec 2025).
Bull · Base · Bear
InsightNodes editorial analysis of Taiwan Semiconductor Manufacturing Company, built only on the cited sources — what each case would require, not a forecast, probability or recommendation.
Bull case
- TSMC keeps beating guidance: each of the last four quarters came in above the guided midpoint (by 1.5-3.4%), with 3Q26 above the top of the range.Trigger: 4Q26 revenue above US$54.3B (top of guided range) when reported in January 2027. [TSMC (SEC Form 6-K earnings release)] [TSMC (Form 6-K, Exhibit 99.1)]
Base case
- 2026 revenue grows around 44% in US dollars, with 4Q26 at US$52.3-54.3B and gross margin 65-67%.Trigger: Monthly sales for Oct-Dec 2026 (released Nov 10, Dec 10, Jan 8) sum to roughly US$52-54B. [TSMC (SEC Form 6-K earnings release)] [TSMC Investor Relations]
Bear case
- Back-end (CoWoS) and tool shortages cap shipments despite demand above supply.Trigger: TSMC guides a quarter below consensus citing packaging or tool constraints, or guided revenue growth slows below 5% QoQ. [TSMC (earnings call transcript)] [Silicon Analysts]
Full cases in the Full Analyst Report.
TSMC is the world's leading dedicated semiconductor foundry, manufacturing advanced chips for AI, high-performance computing and smartphone customers and providing CoWoS advanced packaging. FY2025 revenue was about NT$3.8T (US$122B, +31.6%) at a 59.9% gross margin. 3Q26 revenue rose 50.9% to NT$1.49T with a 66.4% gross margin and net income of NT$763.1B, and 2nm reached 8% of wafer revenue. TSMC guides 4Q26 revenue of US$52.3-54.3B and full-year 2026 growth of about 44% in US dollars, with a 2026 capital budget of US$60-64B. Its second Arizona fab is scheduled for volume production in 3Q 2027.
Leading Indicators
Hiring and patent filing trends — the underlying numbers Momentum is computed from. Insider filing activity is tracked separately under Sources below.
Additional Intelligence Signals
Patent citation lineage, earnings-call mentions, and federal contract disclosures — automatically collected, not yet visible anywhere else on the site.
Sources
Every claim traced to a primary source — evidence, recent activity, and insider filing behavior, all in one place.
Evidence
65 sources · 9 government/SEC filings
- Morgan Stanley Research (via X/Rohan Paul) — TSMC's 2026 revenue mix: NVIDIA 20%, Apple 16%, Broadcom 11%, AMD 8%citeresearch
- U.S. Securities and Exchange Commission (EDGAR) — Taiwan Semiconductor Manufacturing Co Ltd FY2025 Annual Report (Form 20-F), filed with the SECcitegovernment
- TSMC Technology Symposium 2026 / TSMC public disclosures — TSMC advanced-packaging roadmap: CoWoS-L, SoIC, SoW-X, COUPEcitecompany
- Astute Group (semiconductor industry reporting) — TSMC relies on Amkor Technology as an outsourced advanced-packaging (OSAT) partner to absorb CoWoS overflow demandcitenews
- TSMC (Form 6-K, Exhibit 99.1) — TSMC 1Q26 earnings release (2Q26 guidance)citecompany
- TSMC Investor Relations (Management Report, Chinese edition) — TSMC 1Q26 Management Reportcitecompany
- TSMC (Form 6-K, Exhibit 99.1) — TSMC 2Q26 earnings release (3Q26 guidance)citecompany
- TSMC Investor Relations (Management Report) — TSMC 2Q26 Management Reportcitecompany
- TSMC (Form 6-K, Exhibit 99.1) — TSMC 3Q25 earnings release (4Q25 guidance)citecompany
- TSMC (earnings call transcript) — TSMC 3Q26 earnings call transcriptcitecompany
- TSMC (SEC Form 6-K earnings release) — TSMC 3Q26 earnings releasecitecompany
- TSMC (Management Report) — TSMC 3Q26 management reportcitecompany
- TSMC (earnings call transcript) — TSMC 4Q25 earnings call transcript (full-year 2025 review)citecompany
- TSMC (press release) — TSMC 4Q25 earnings releasecitecompany
- TSMC (Form 20-F) — TSMC 2025 Form 20-F: Bonds payablecitecompany
- TSMC (Investor Relations) — TSMC investor relations: Credit Rating pagecitecompany
- TSMC Investor Relations — TSMC financial calendarcitecompany
- Applied Materials / TSMC public disclosures — TSMC and Applied Materials joint technology development and process collaborationcitecompany
- PatentPC (semiconductor equipment industry analysis) — TSMC is among the foundries structurally dependent on Applied Materials for etch and deposition equipmentciteresearch
- FinancialContent — TSMC begins high-volume Blackwell production at its Arizona fabcitenews
- U.S. Department of Commerce — TSMC Arizona receives finalized $6.6 billion in CHIPS Act direct funding from the US Commerce Departmentcitegovernment
- Tom's Hardware (industry reporting) — TSMC depends on ASML as sole global supplier of EUV lithography systems for advanced-node chip manufacturingcitenews
- ASML / TSMC joint press release — ASML and TSMC announce joint High-NA EUV photomask initiativecitecompany
- TechCrunch / CommonWealth Magazine — TSMC manufactures AWS Trainium AI chips using 3nm process and CoWoS packagingcitenews
- Optics.org / Ayar Labs — Ayar Labs and Alchip Scale Co-Packaged Optics With TSMCcitenews
- Cadence — Cadence expands AI-driven EDA partnership with TSMCcitecompany
- TSMC 6-K filing (SEC EDGAR) — TSMC raises FY2026 capex outlook to $60-64B amid AI demandcitegovernment
- Cerebras / Industry reporting — Cerebras Wafer Scale Engine Manufactured by TSMCcitenews
- US Department of Commerce — US Commerce Department finalizes $6.6B CHIPS Act award to TSMC Arizonacitegovernment
- Cornelis Networks press release via Business Wire (reprinted on silicon.co.uk) — Cornelis Networks CN5000 launch press release: TSMC collaborationcitecompany
- Industry reporting (TweakTown/NVIDIA Developer Blog) — TSMC Silicon Photonics COUPE Co-Packaged Optics Samples for NVIDIA, Broadcomcitenews
- Silicon Analysts — TSMC's advanced packaging lines fully booked into 2026citeresearch
- TSMC Form 20-F (FY2025) — TSMC FY2025 20-F discloses customer revenue concentrationcitegovernment
- NXP Semiconductors (SEC Form 10-K) — NXP FY2025 Form 10-K: ESMC ownershipcitecompany
- TrendForce / Tom's Hardware — JSR, Tokyo Ohka Kogyo (TOK) and Shin-Etsu Chemical supply EUV photoresist to TSMCcitenews
- Public regulatory disclosures — TSMC's advanced-node exposure to Taiwan and US export-control regimescitegovernment
- TrendForce / Google Cloud Blog / Jon Peddie Research — TSMC manufactures Google's Ironwood TPU v7 AI acceleratorcitenews
- GSI Technology, Inc. (SEC Form 10-K) — GSI Technology, Inc. (SEC Form 10-K): Notes, Concentrations / Item 1Acitecompany
- Hoya / industry disclosures — Hoya Corporation supplies photomask blanks to TSMCcitecompany
- Impinj, Inc. (SEC Form 10-K) — Impinj FY2025 Form 10-Kcitecompany
- Intel (official newsroom) — Intel Announces 2024 EPIC Supplier Program Award Recipientscitecompany
- Sony / TSMC joint press release — TSMC holds minority investment in AVS Japan image-sensor JV with Sony Semiconductor Solutionscitecompany
- Linde plc (official) / gasworld — Linde and Air Liquide supply ultra-high-purity industrial gases on-site to TSMC fabscitecompany
- LX Semicon Co., Ltd. — 사업보고서 (FY2025 business report, DART) — LX Semicon FY2025 business report: principal raw-material supplierscitecompany
- Marvell Technology (SEC Form 10-Q) — Marvell Technology 10-Q (2026)citecompany
- DigiTimes / industry reporting — TSMC is a longstanding primary foundry partner for MediaTek's smartphone processorscitenews
- TechCrunch / SemiWiki — Meta's MTIA 'Iris' AI training chip is manufactured by TSMC on its 3nm processcitenews
- Tom's Hardware — Tom's Hardware: Micron teams up with TSMC to deliver HBM4E base logic diecitenews
- TrendForce / Microsoft Official Blog — Microsoft's Maia 200 AI accelerator is fabricated on TSMC's 3nm processcitenews
- Mobileye Global Inc. (SEC Form 10-K) — Mobileye Global 2025 Form 10-Kcitecompany
- Navitas Semiconductor (SEC Form 10-K) — Navitas Semiconductor FY2025 Form 10-K: manufacturing partnerscitecompany
- TSMC Annual Report (risk factors) — TSMC's Taiwan fab operations depend on water, electricity, gases, and specialty chemicalscitecompany
- CNBC / Digitimes — TSMC Q2 2026 profit surges 77% on first 2nm revenue contributioncitemarket-data
- Techtimes / Ad-Hoc-News — TSMC guides Q3 2026 revenue to ~$44.6-45.8B; CoWoS squeeze pushes some customers to Samsungcitenews
- PhoneArena / industry reporting — TSMC manufactures Qualcomm's flagship Snapdragon chipscitenews
- SiPearl (press release via Business Wire) — SiPearl release: Rhea1 manufactured by TSMCcitecompany
- Taipei Times — Chip competition is getting fiercecitenews
- TSMC / Sony Semiconductor Solutions — Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation Image Sensorscitecompany
- Synopsys — Synopsys expands partnership with TSMC across N2/A16/A14 nodescitecompany
- Taiwan Stock Exchange (TWSE) ISIN code list for listed equities — TWSE List of ISIN Code for Listed Equitiesciteinstitution
- Techpoint, Inc. (SEC Form 10-K) — Techpoint, Inc. FY2024 Form 10-Kcitegovernment
- NIST CHIPS for America (U.S. Department of Commerce) — NIST CHIPS award page: TSMC Arizona (Phoenix)citegovernment
- UCIe Consortium (official website) — UCIe Consortium membership page: Promoter Memberscitecompany
- Valens Semiconductor Ltd. (SEC Form 20-F) — Valens Semiconductor Ltd. (SEC Form 20-F): Item 3.D Risk Factors / Item 4citecompany
- TSMC (TWSE/MOPS financial report) — TSMC FY2025 IFRS consolidated financial statements (English): Note 13 Investments accounted for using equity methodcitecompany
Insider Filing Activity
Counts filing frequency only — transaction direction/size wasn't parseable from the sampled filings · sourced from SEC EDGAR · as of Sep 7, 2026
Insider Timing
An insider acquired 51 shares on Aug 7, 2026 — 3 days before a recorded milestone: “July 2026 revenue up 44.7% YoY, outpacing Q2 guidance”
Timing correlation only — not evidence of a causal link
An insider acquired 41 shares on Aug 7, 2026 — 3 days before a recorded milestone: “July 2026 revenue up 44.7% YoY, outpacing Q2 guidance”
Timing correlation only — not evidence of a causal link
An insider acquired 42 shares on Aug 7, 2026 — 3 days before a recorded milestone: “July 2026 revenue up 44.7% YoY, outpacing Q2 guidance”
Timing correlation only — not evidence of a causal link
Acquisition & Investment Fit
AI-reasoned, generated only from entities already in InsightNodes's own graph — a hypothetical strategic-fit exercise, not real M&A intelligence or a signal that any deal is planned or in progress.
Relationship Map
Who Taiwan Semiconductor Manufacturing Company relies on, who relies on it, where its capital goes, and who it competes with — the most important connections first. Search for any company to see how it links to Taiwan Semiconductor Manufacturing Company, or open the full list.
Showing the most important 24 of 246 connections, ranked by importance and sourcing. Hover to isolate one, click for its sources. Thicker line = more important; dashed = no source linked yet.
The Story So Far (last 6 months)
Auto-generated from this entity's dated milestones, relationship updates, and sourced evidence — not AI-written, just sorted.
Emerging Signals
Advanced Manufacturing Demand
CriticalGrowth in artificial intelligence computing is increasing demand for leading-edge semiconductor manufacturing and advanced packaging.
Market Intelligence
UnverifiedCredibly-reported claims — analyst notes, sourcing citing “people familiar with the matter,” deals where the companies involved declined to comment — that haven't been officially confirmed. Kept structurally separate from the sourced evidence above; treat as a lead worth researching further, not an established fact.
Reported clash with ASML over equipment price increases
40% confidenceASML reportedly plans to raise prices on its chipmaking equipment, setting up a potential dispute with TSMC, its largest customer, over the increases.
Reported by The Information; TSMC declined to comment on the price increases, and ASML's own representative pointed only to prior CFO earnings-call remarks on pricing without confirming specifics.
The Information (via Taipei Times) · Jul 20, 2026
Taiwan Semiconductor Manufacturing Company's Timeline
A sourced, dated history of Taiwan Semiconductor Manufacturing Company's key moments — founding to present.
Jan 2026 · Arizona fab begins Blackwell production
NVIDIA's Blackwell GPUs entered high-volume production at TSMC's Arizona fab in early 2026, a step toward TSMC's goal of a fully domestic US supply chain by 2028.
Jul 2026 · Q2 2026 profit surges 77% on first 2nm revenue, adds $100B Arizona investment
TSMC reported Q2 2026 revenue of NT$1,270.38 billion (up 36.0% YoY) and net income of NT$706.56 billion (up 77.4% YoY), with 2nm wafers contributing 3% of total wafer revenue in their first quarter of production; the company raised 2026 capex guidance to $60-64 billion and announced an additional $100 billion investment in Arizona for new fabs to meet US demand, while flagging a 3-4 percentage point gross-margin headwind in H2 2026 from the 2nm ramp.
Aug 2026 · July 2026 revenue up 44.7% YoY, outpacing Q2 guidance
TSMC reported July 2026 net revenue of roughly NT$467.6 billion, up 44.7% year-over-year and 5.6% month-over-month, a growth pace well above the 36-37% range guided at its Q2 2026 earnings call, reflecting continued AI-driven demand for advanced nodes.
Source
How These Connections Evolved
How a relationship changed over time, not just its current state — sourced, dated, and traceable.
Taiwan Semiconductor Manufacturing Company ↔ Apple
Oct 2023 · 3nm ramp reaches ~15% of TSMC quarterly revenue
Apple's A17 Pro and M3-family chips drove TSMC's 3nm process from about 6% of quarterly revenue in Q3 2023 to roughly 15% in Q4 2023, as 3nm shifted from early-stage to a meaningful share of TSMC's overall business.
SourceJan 2024 · Apple becomes TSMC's largest 3nm customer
Apple's 3nm orders grew by an estimated 50% year-over-year, making Apple TSMC's largest customer for 3nm chips in 2024 and pushing 3nm past 20% of TSMC's total revenue for the year.
SourceNow
TSMC is Apple's exclusive chip fabricator, with Apple representing roughly 16% of TSMC's projected 2026 revenue, its second-largest named customer after NVIDIA.
Taiwan Semiconductor Manufacturing Company ↔ NVIDIA
Jan 2026
NVIDIA's Blackwell GPUs entered high-volume production at TSMC's Arizona fab in early 2026, though wafers still ship back to Taiwan for CoWoS packaging pending TSMC's goal of a fully domestic US supply chain by 2028.
Now
TSMC manufactures advanced semiconductor products designed by NVIDIA.
Taiwan Semiconductor Manufacturing Company ↔ Advanced Micro Devices
2024–2025
TSMC fabricated AMD's MI300X (CDNA 3) and next-generation MI350X (CDNA 4, 3nm) accelerators, competing for the same advanced-node and CoWoS packaging capacity as NVIDIA's Blackwell line.
Now
TSMC manufactures advanced semiconductor products designed by AMD.
Taiwan Semiconductor Manufacturing Company ↔ ASML
Nov 2024 · First High-NA EUV tool ordered, adoption deferred
TSMC arranged to receive its first ASML High-NA EUV lithography machine (the TWINSCAN EXE:5000, capable of printing lines as thin as 8nm) by year-end, becoming the second manufacturer after Intel to receive one — but held off on production adoption.
SourceJan 2026 · High-NA adoption deferred to 2029 over cost
TSMC signaled no plans to introduce High-NA EUV into production before 2029, with senior leadership citing cost as the main barrier — even as Intel and Samsung moved ahead with their own High-NA adoption plans, marking a rare divergence in TSMC's usually fast equipment-adoption pace.
SourceNow
TSMC depends on advanced lithography equipment supplied by ASML for leading-edge semiconductor manufacturing.
Taiwan Semiconductor Manufacturing Company ↔ Extreme Ultraviolet Lithography
2018–2026
TSMC was among ASML's earliest and largest EUV customers for 7nm/5nm production, but deferred adopting ASML's newer High-NA EUV tools into production until 2029 over cost concerns, even after receiving its first High-NA machine in late 2024 — a rare divergence from its usually fast equipment-adoption pace.
Now
TSMC uses extreme ultraviolet lithography in advanced semiconductor manufacturing processes.
Taiwan Semiconductor Manufacturing Company ↔ CoWoS Advanced Packaging
Jan 2025
TSMC roughly doubled CoWoS capacity to a record 75,000-80,000 wafers per month, aiming to close the persistent supply-demand gap for advanced AI chip packaging.
Jan 2026
TSMC targeted quadrupling advanced packaging capacity to 120,000-140,000 CoWoS wafers per month by late 2026, with the supply-demand gap reportedly narrowing from roughly 20% to 10% by year-end as capacity expanded.
Now
TSMC develops and operates CoWoS advanced packaging technology.
Taiwan Semiconductor Manufacturing Company ↔ Advanced Semiconductor Packaging
2024–2026
TSMC scaled CoWoS advanced-packaging capacity from roughly 30-40k wafers/month (2024) to 75-80k (2025) toward a 120-140k target (2026), while increasingly outsourcing overflow demand to ASE as AI chip demand outstripped its own capacity.
Now
TSMC develops advanced semiconductor packaging technologies used to integrate sophisticated computing systems.
Taiwan Semiconductor Manufacturing Company ↔ CHIPS and Science Act
Apr 2024
TSMC Arizona and the Department of Commerce signed preliminary terms for up to $6.6 billion in CHIPS Act direct funding, supporting TSMC's planned $65 billion+ investment across three Phoenix fabs.
Nov 2024
The $6.6 billion CHIPS Act award to TSMC Arizona was formally finalized, with funds disbursed against completion of project milestones — the first Phoenix fab targeting 4nm production in the first half of 2025, the second targeting 2nm production from 2028.
Now
TSMC's US manufacturing expansion, including its Arizona fabrication facilities, depends on CHIPS Act incentive funding.
Taiwan Semiconductor Manufacturing Company ↔ Blackwell
Jan 2024
TSMC moved to secure a larger, multi-year share of its expanding CoWoS advanced packaging capacity for Blackwell production, aiming to avoid the capacity bottlenecks seen during the prior Hopper generation's ramp.
Jan 2025
NVIDIA reserved the majority of TSMC's advanced CoWoS packaging capacity through 2027 to cover both Blackwell and next-generation Rubin GPU production.
Now
Production of advanced Blackwell processors depends on sophisticated semiconductor manufacturing capabilities.
Taiwan Semiconductor Manufacturing Company ↔ Co-Packaged Optics
2024–2025
TSMC's COUPE silicon-photonics packaging process became the manufacturing foundation for NVIDIA's Quantum-X and Spectrum-X Photonics co-packaged optics switches, positioning TSMC as a critical bottleneck for next-generation optical networking hardware.
Now
Co-packaged optics manufacturing depends on TSMC's COUPE silicon photonics packaging process, which both NVIDIA and Broadcom rely on for their optical switch products.
Taiwan Semiconductor Manufacturing Company ↔ Semiconductor Manufacturing
2024–2026
TSMC's total advanced-node demand roughly tripled from about 370,000 wafers in 2024 toward approaching 1 million by 2026, with CoWoS packaging lines fully booked at 52-78 week lead times, reinforcing its dominant foundry position.
Now
TSMC dominates the global semiconductor foundry industry, manufacturing the vast majority of the world's most advanced AI chips.
Taiwan Semiconductor Manufacturing Company ↔ Applied Materials
2024–2025
Applied Materials expanded wafer fabrication and advanced-packaging equipment supply to TSMC as leading-edge and CoWoS capacity scaled to meet surging AI chip demand.
Now
Applied Materials supplies wafer fabrication and advanced packaging equipment used across TSMC's leading-edge chip manufacturing.