Semiconductor Manufacturing
Taiwan Semiconductor Manufacturing Company
TSMC is the world's leading dedicated semiconductor foundry, manufacturing the advanced processors used across AI and high-performance computing. NVIDIA's Blackwell GPUs entered high-volume production at TSMC's Arizona fab in early 2026, and its CoWoS packaging lines were fully booked with 52-78 week lead times as demand roughly tripled from 370,000 wafers in 2024 to nearly 1 million in 2026.
Leading Indicators
Hiring and patent filing trends — the underlying numbers Momentum is computed from. Insider filing activity is tracked separately under Sources below.
Additional Intelligence Signals
Patent citation lineage, earnings-call mentions, and federal contract disclosures — automatically collected, not yet visible anywhere else on the site.
Sources
Every claim traced to a primary source — evidence, recent activity, and insider filing behavior, all in one place.
Evidence
5 sources · 1 government/SEC filing · 79% avg. source confidence
- U.S. Securities and Exchange Commission (EDGAR) — Taiwan Semiconductor Manufacturing Co Ltd FY2025 Annual Report (Form 20-F), filed with the SEC95% source confidence
- Morgan Stanley Research (via X/Rohan Paul) — TSMC's 2026 revenue mix: NVIDIA 20%, Apple 16%, Broadcom 11%, AMD 8%62% source confidence
- FinancialContent — TSMC begins high-volume Blackwell production at its Arizona fab85% source confidence
- Silicon Analysts — TSMC's advanced packaging lines fully booked into 202675% source confidence
- CNBC / Digitimes — TSMC Q2 2026 profit surges 77% on first 2nm revenue contribution80% source confidence
Insider Filing Activity
Direction/size reflects a sample of the most recent filings, not every Form 4 in the window · sourced from SEC EDGAR · as of Jul 28, 2026
Insider Timing
An insider acquired 1,000 shares on Jul 21, 2026 — 5 days after a recorded milestone: “Q2 2026 profit surges 77% on first 2nm revenue, adds $100B Arizona investment”
Timing correlation only — not evidence of a causal link
An insider acquired 1,000 shares on Jul 21, 2026 — 5 days after a recorded milestone: “Q2 2026 profit surges 77% on first 2nm revenue, adds $100B Arizona investment”
Timing correlation only — not evidence of a causal link
An insider acquired 1,000 shares on Jul 20, 2026 — 4 days after a recorded milestone: “Q2 2026 profit surges 77% on first 2nm revenue, adds $100B Arizona investment”
Timing correlation only — not evidence of a causal link
Dependency Map
What Taiwan Semiconductor Manufacturing Company depends on below, and who depends on Taiwan Semiconductor Manufacturing Company above — click any node to make it the new center, 2 levels deep.
Connection type
Click any node to make it the new center. Scroll to zoom, drag to pan.
The Story So Far (last 6 months)
Auto-generated from this entity's dated milestones, relationship updates, and sourced evidence — not AI-written, just sorted.
Emerging Signals
Advanced Manufacturing Demand
CriticalGrowth in artificial intelligence computing is increasing demand for leading-edge semiconductor manufacturing and advanced packaging.
Market Intelligence
UnverifiedCredibly-reported claims — analyst notes, sourcing citing “people familiar with the matter,” deals where the companies involved declined to comment — that haven't been officially confirmed. Kept structurally separate from the sourced evidence above; treat as a lead worth researching further, not an established fact.
Reported clash with ASML over equipment price increases
40% confidenceASML reportedly plans to raise prices on its chipmaking equipment, setting up a potential dispute with TSMC, its largest customer, over the increases.
Reported by The Information; TSMC declined to comment on the price increases, and ASML's own representative pointed only to prior CFO earnings-call remarks on pricing without confirming specifics.
The Information (via Taipei Times) · Jul 20, 2026
Taiwan Semiconductor Manufacturing Company's Timeline
A sourced, dated history of Taiwan Semiconductor Manufacturing Company's key moments — founding to present.
Jan 1987 · Founded
TSMC was founded, pioneering the pure-play semiconductor foundry model and becoming the world's leading dedicated chip manufacturer.
Jan 2026 · Arizona fab begins Blackwell production
NVIDIA's Blackwell GPUs entered high-volume production at TSMC's Arizona fab in early 2026, a step toward TSMC's goal of a fully domestic US supply chain by 2028.
Jul 2026 · Q2 2026 profit surges 77% on first 2nm revenue, adds $100B Arizona investment
TSMC reported Q2 2026 revenue of NT$1,270.38 billion (up 36.0% YoY) and net income of NT$706.56 billion (up 77.4% YoY), with 2nm wafers contributing 3% of total wafer revenue in their first quarter of production; the company raised 2026 capex guidance to $60-64 billion and announced an additional $100 billion investment in Arizona for new fabs to meet US demand, while flagging a 3-4 percentage point gross-margin headwind in H2 2026 from the 2nm ramp.
How These Connections Evolved
How a relationship changed over time, not just its current state — sourced, dated, and traceable.
Taiwan Semiconductor Manufacturing Company ↔ Apple
Oct 2023 · 3nm ramp reaches ~15% of TSMC quarterly revenue
Apple's A17 Pro and M3-family chips drove TSMC's 3nm process from about 6% of quarterly revenue in Q3 2023 to roughly 15% in Q4 2023, as 3nm shifted from early-stage to a meaningful share of TSMC's overall business.
SourceJan 2024 · Apple becomes TSMC's largest 3nm customer
Apple's 3nm orders grew by an estimated 50% year-over-year, making Apple TSMC's largest customer for 3nm chips in 2024 and pushing 3nm past 20% of TSMC's total revenue for the year.
SourceNow
TSMC is Apple's exclusive chip fabricator, with Apple representing roughly 16% of TSMC's projected 2026 revenue, its second-largest named customer after NVIDIA.
Taiwan Semiconductor Manufacturing Company ↔ NVIDIA
Jan 2026
NVIDIA's Blackwell GPUs entered high-volume production at TSMC's Arizona fab in early 2026, though wafers still ship back to Taiwan for CoWoS packaging pending TSMC's goal of a fully domestic US supply chain by 2028.
Now
TSMC manufactures advanced semiconductor products designed by NVIDIA.
Taiwan Semiconductor Manufacturing Company ↔ Advanced Micro Devices
2024–2025
TSMC fabricated AMD's MI300X (CDNA 3) and next-generation MI350X (CDNA 4, 3nm) accelerators, competing for the same advanced-node and CoWoS packaging capacity as NVIDIA's Blackwell line.
Now
TSMC manufactures advanced semiconductor products designed by AMD.
Taiwan Semiconductor Manufacturing Company ↔ ASML
Nov 2024 · First High-NA EUV tool ordered, adoption deferred
TSMC arranged to receive its first ASML High-NA EUV lithography machine (the TWINSCAN EXE:5000, capable of printing lines as thin as 8nm) by year-end, becoming the second manufacturer after Intel to receive one — but held off on production adoption.
SourceJan 2026 · High-NA adoption deferred to 2029 over cost
TSMC signaled no plans to introduce High-NA EUV into production before 2029, with senior leadership citing cost as the main barrier — even as Intel and Samsung moved ahead with their own High-NA adoption plans, marking a rare divergence in TSMC's usually fast equipment-adoption pace.
SourceNow
TSMC depends on advanced lithography equipment supplied by ASML for leading-edge semiconductor manufacturing.
Taiwan Semiconductor Manufacturing Company ↔ Extreme Ultraviolet Lithography
2018–2026
TSMC was among ASML's earliest and largest EUV customers for 7nm/5nm production, but deferred adopting ASML's newer High-NA EUV tools into production until 2029 over cost concerns, even after receiving its first High-NA machine in late 2024 — a rare divergence from its usually fast equipment-adoption pace.
Now
TSMC uses extreme ultraviolet lithography in advanced semiconductor manufacturing processes.
Taiwan Semiconductor Manufacturing Company ↔ Chip-on-Wafer-on-Substrate
Jan 2025
TSMC roughly doubled CoWoS capacity to a record 75,000-80,000 wafers per month, aiming to close the persistent supply-demand gap for advanced AI chip packaging.
Jan 2026
TSMC targeted quadrupling advanced packaging capacity to 120,000-140,000 CoWoS wafers per month by late 2026, with the supply-demand gap reportedly narrowing from roughly 20% to 10% by year-end as capacity expanded.
Now
TSMC develops and operates CoWoS advanced packaging technology.
Taiwan Semiconductor Manufacturing Company ↔ Advanced Semiconductor Packaging
2024–2026
TSMC scaled CoWoS advanced-packaging capacity from roughly 30-40k wafers/month (2024) to 75-80k (2025) toward a 120-140k target (2026), while increasingly outsourcing overflow demand to ASE as AI chip demand outstripped its own capacity.
Now
TSMC develops advanced semiconductor packaging technologies used to integrate sophisticated computing systems.
Taiwan Semiconductor Manufacturing Company ↔ CHIPS and Science Act
Apr 2024
TSMC Arizona and the Department of Commerce signed preliminary terms for up to $6.6 billion in CHIPS Act direct funding, supporting TSMC's planned $65 billion+ investment across three Phoenix fabs.
Nov 2024
The $6.6 billion CHIPS Act award to TSMC Arizona was formally finalized, with funds disbursed against completion of project milestones — the first Phoenix fab targeting 4nm production in the first half of 2025, the second targeting 2nm production from 2028.
Now
TSMC's US manufacturing expansion, including its Arizona fabrication facilities, depends on CHIPS Act incentive funding.
Taiwan Semiconductor Manufacturing Company ↔ Blackwell
Jan 2024
TSMC moved to secure a larger, multi-year share of its expanding CoWoS advanced packaging capacity for Blackwell production, aiming to avoid the capacity bottlenecks seen during the prior Hopper generation's ramp.
Jan 2025
NVIDIA reserved the majority of TSMC's advanced CoWoS packaging capacity through 2027 to cover both Blackwell and next-generation Rubin GPU production.
Now
Production of advanced Blackwell processors depends on sophisticated semiconductor manufacturing capabilities.
Taiwan Semiconductor Manufacturing Company ↔ Co-Packaged Optics
2024–2025
TSMC's COUPE silicon-photonics packaging process became the manufacturing foundation for NVIDIA's Quantum-X and Spectrum-X Photonics co-packaged optics switches, positioning TSMC as a critical bottleneck for next-generation optical networking hardware.
Now
Co-packaged optics manufacturing depends on TSMC's COUPE silicon photonics packaging process, which both NVIDIA and Broadcom rely on for their optical switch products.
Taiwan Semiconductor Manufacturing Company ↔ Semiconductor Manufacturing
2024–2026
TSMC's total advanced-node demand roughly tripled from about 370,000 wafers in 2024 toward approaching 1 million by 2026, with CoWoS packaging lines fully booked at 52-78 week lead times, reinforcing its dominant foundry position.
Now
TSMC dominates the global semiconductor foundry industry, manufacturing the vast majority of the world's most advanced AI chips.
Taiwan Semiconductor Manufacturing Company ↔ Applied Materials
2024–2025
Applied Materials expanded wafer fabrication and advanced-packaging equipment supply to TSMC as leading-edge and CoWoS capacity scaled to meet surging AI chip demand.
Now
Applied Materials supplies wafer fabrication and advanced packaging equipment used across TSMC's leading-edge chip manufacturing.