Taiwan Semiconductor Manufacturing Company

Headquarters

Hsinchu, Taiwan

Website

www.tsmc.com

Employees

90,557 (FY2025 annual report)

Founded

1987

Listing

TSM · NYSE (ADR) / Taiwan Stock Exchange

Market Cap

— (temporarily unavailable)

Price

USD398.37 (-8.23%)

Dependency

• Taiwan Semiconductor Export Controls: TSMC's overseas technology transfers, including to its US fabs, would be directly constrained by Taiwan's proposed 'N-2' rule capping exports to two generations behind its leading-edge node.
• Lam Research: TSMC depends on Lam Research wafer fabrication equipment for leading-edge logic node production.
• Synopsys: TSMC's advanced process nodes (N3, N2, A16, A14) rely on Synopsys EDA tools and silicon-proven IP under an expanded 2026 partnership.
• Cadence Design Systems: TSMC's advanced process nodes rely on Cadence's AI-driven EDA workflows and design infrastructure under an expanded 2026 partnership.
• Amkor Technology: TSMC finalized a 10-year advanced packaging and test partnership with Amkor in June 2026, giving TSMC a local Arizona procurement channel for advanced packaging and test services as it builds out its Arizona fabs.
• ASML: TSMC depends on advanced lithography equipment supplied by ASML for leading-edge semiconductor manufacturing.
• Extreme Ultraviolet Lithography: TSMC uses extreme ultraviolet lithography in advanced semiconductor manufacturing processes.
• ASE Technology: TSMC increasingly relies on ASE as a secondary packaging supply chain, transferring on-substrate outsourcing work as AI chip demand outstrips TSMC's own capacity.
• CHIPS and Science Act: TSMC's US manufacturing expansion, including its Arizona fabrication facilities, depends on CHIPS Act incentive funding.
• Applied Materials: Applied Materials supplies wafer fabrication and advanced packaging equipment used across TSMC's leading-edge chip manufacturing.
• KLA Corporation: KLA's process control and wafer inspection tools are used across TSMC's leading-edge manufacturing to detect defects and yield issues in real time.
• Tokyo Electron: Tokyo Electron supplies deposition and etch equipment used across TSMC's advanced chip manufacturing.
• Advantest: Advantest's automated test equipment is used to verify advanced chips including those manufactured by TSMC.
• ASM International: ASM International's atomic layer deposition equipment is used in advanced logic and memory chip manufacturing.
• Entegris: Entegris supplies specialty materials and contamination-control products used in TSMC's chip manufacturing.
• GlobalWafers: GlobalWafers supplies silicon wafers used as the base substrate for TSMC's chip manufacturing.
• Axcelis Technologies: Axcelis supplies ion implantation equipment used in advanced chip manufacturing processes.

Supply Chain

• Espressif Systems: TSMC is a key foundry partner for fabless IoT chipmakers including Espressif Systems.
• Himax Technologies: TSMC is a key foundry partner for Himax Technologies' display driver and sensor chips.
• Socionext: TSMC is a key foundry partner for Socionext's custom SoC designs.
• Sony: Sony Semiconductor Solutions and TSMC signed a preliminary agreement for a strategic partnership developing next-generation image sensors for physical AI applications including automotive and robotics.
• Microsoft Azure: TSMC fabricates Microsoft's Maia 200 AI accelerator chip on its 3-nanometer process.
• Apple: TSMC is Apple's exclusive chip fabricator, with Apple representing roughly 16% of TSMC's projected 2026 revenue, its second-largest named customer after NVIDIA.
• Broadcom: TSMC fabricates Broadcom's custom silicon and networking chips, with Broadcom representing roughly 11% of TSMC's projected 2026 revenue.
• Qualcomm: TSMC is Qualcomm's primary foundry partner for advanced mobile and AI chips.
• Meta: TSMC fabricates Meta's custom MTIA AI accelerator chips (including the newer Iris generation), using advanced nodes down to 3nm with CoWoS packaging.
• Amazon Web Services: TSMC fabricates Amazon's custom Trainium AI chips (including Trainium3 on a 3nm process) through Amazon's Annapurna Labs design subsidiary.
• NVIDIA: TSMC manufactures advanced semiconductor products designed by NVIDIA.
• Advanced Micro Devices: TSMC manufactures advanced semiconductor products designed by AMD.
• Blackwell: Production of advanced Blackwell processors depends on sophisticated semiconductor manufacturing capabilities.
• Co-Packaged Optics: Co-packaged optics manufacturing depends on TSMC's COUPE silicon photonics packaging process, which both NVIDIA and Broadcom rely on for their optical switch products.
• Tesla: Tesla's AI5 chip is also manufactured at TSMC, split alongside Samsung Foundry production.
• Ayar Labs: Ayar Labs' co-packaged optics solution is built with TSMC, using the foundry's advanced packaging and process technology to integrate optical engines onto a common substrate with AI accelerators.
• Cerebras Systems: Cerebras Systems' Wafer Scale Engine chips are manufactured by TSMC.
• MediaTek: MediaTek depends on TSMC for manufacturing its chip designs.

Development

• Chip-on-Wafer-on-Substrate: TSMC develops and operates CoWoS advanced packaging technology.
• Advanced Semiconductor Packaging: TSMC develops advanced semiconductor packaging technologies used to integrate sophisticated computing systems.

Enablement

• European Chips Act: TSMC's European Semiconductor Manufacturing Company (ESMC) joint venture fab in Dresden, Germany is backed by EU Chips Act state aid covering roughly half of its €10 billion-plus investment.

Competition / Other

• Semiconductor Manufacturing: TSMC dominates the global semiconductor foundry industry, manufacturing the vast majority of the world's most advanced AI chips.
• Samsung Foundry: Samsung Foundry competes with TSMC for advanced-node (2nm and below) foundry customers, though TSMC retains the large majority of leading-edge market share.