Sourced evidence
ASML and TSMC announce joint High-NA EUV photomask initiative
On September 8, 2026, ASML and TSMC announced a joint initiative on 12-inch photomasks intended to support High-NA (0.55 NA) EUV lithography development, with TSMC and ASML expressing intent toward High-NA high-volume manufacturing (HVM) readiness around 2030. As of this evidence date, this is an ANNOUNCED/DEVELOPMENT-stage initiative; TSMC's current production EUV usage remains standard (0.33 NA) EUV, and High-NA is not yet in TSMC current high-volume manufacturing.
- Type
- Company filing or release
- Published
- September 8, 2026
- Confidence
- 60/100
- Filed under
- Taiwan Semiconductor Manufacturing Company
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InsightNodes, "ASML and TSMC announce joint High-NA EUV photomask initiative" (Taiwan Semiconductor Manufacturing Company). Source: ASML / TSMC joint press release, September 8, 2026, https://www.asml.com. https://insightnodes.com/claims/e/tsmc-asml-highna-2026 (accessed October 30, 2026).
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