Sourced evidence
TSMC manufactures AWS Trainium AI chips using 3nm process and CoWoS packaging
Amazon Web Services' Trainium3 chip is produced by TSMC on its 3-nanometer process using CoWoS advanced packaging technology; Amazon's Annapurna Labs is reported among TSMC's top-five customers by wafer volume.
- Type
- News report
- Published
- March 22, 2026
- Confidence
- 76/100
- Filed under
- Taiwan Semiconductor Manufacturing Company
Supports these links
Cite this
InsightNodes, "TSMC manufactures AWS Trainium AI chips using 3nm process and CoWoS packaging" (Taiwan Semiconductor Manufacturing Company). Source: TechCrunch / CommonWealth Magazine, March 22, 2026, https://techcrunch.com/2026/03/22/an-exclusive-tour-of-amazons-trainium-lab-the-chip-thats-won-over-anthropic-openai-even-apple/. https://insightnodes.com/claims/e/tsmc-aws-trainium-manufacturing (accessed October 29, 2026).
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