TSMC 2025 Form 20-F: Bonds payable

As of December 31, 2025 (NT$ millions): domestic unsecured bonds 538,388.0; overseas unsecured bonds 455,938.0; less discounts 2,292.5; less current portion 135,806.0; long-term portion 856,227.5 (net total 992,033.5). Source extract: "Domestic unsecured bonds ... Overseas unsecured bonds"

Source: TSMC (Form 20-F)
Type: Company filing or release
Confidence: 85/100
Filed under: Taiwan Semiconductor Manufacturing Company

Cite this

InsightNodes, "TSMC 2025 Form 20-F: Bonds payable" (Taiwan Semiconductor Manufacturing Company). Source: TSMC (Form 20-F), https://www.sec.gov/Archives/edgar/data/1046179/000162828026025362/R24.htm. https://insightnodes.com/claims/e/tsmc-analyst-credit-20f-bonds-2025 (accessed October 29, 2026).

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