TSMC relies on Amkor Technology as an outsourced advanced-packaging (OSAT) partner to absorb CoWoS overflow demand

Reporting on TSMC's advanced-packaging capacity crunch describes NVIDIA's CoWoS wafer allocation split between TSMC-internal capacity and non-TSMC OSAT partners including Amkor and ASE, reflecting TSMC's structural reliance on outsourced packaging partners to meet demand it cannot fully service internally.

Source: Astute Group (semiconductor industry reporting)
Type: News report
Confidence: 58/100
Filed under: Taiwan Semiconductor Manufacturing Company

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Taiwan Semiconductor Manufacturing Company relies on Amkor Technology

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InsightNodes, "TSMC relies on Amkor Technology as an outsourced advanced-packaging (OSAT) partner to absorb CoWoS overflow demand" (Taiwan Semiconductor Manufacturing Company). Source: Astute Group (semiconductor industry reporting), https://www.astutegroup.com/news/industrial/advanced-packaging-demand-soars-nvidia-secures-60-of-cowos-capacity/. https://insightnodes.com/claims/e/tsmc-amkor-technology-cowos-osat-overflow-2025 (accessed October 29, 2026).

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