Sourced evidence
NVIDIA secures majority of TSMC's advanced CoWoS packaging capacity
TSMC confirmed NVIDIA's Blackwell GPUs are the first product built on its newest CoWoS-L packaging generation, and reporting indicates NVIDIA has reserved the majority of that capacity through 2027, with TSMC outsourcing simpler packaging steps to ASE and Amkor to keep up with demand.
Supports these links
- NVIDIA develops Blackwell
- NVIDIA relies on Taiwan Semiconductor Manufacturing Company
- NVIDIA relies on Advanced Semiconductor Packaging
Cite this
InsightNodes, "NVIDIA secures majority of TSMC's advanced CoWoS packaging capacity" (NVIDIA). Source: CNBC, April 8, 2026, https://www.cnbc.com/2026/04/08/tsmc-nvidia-advanced-packaging-intel.html. https://insightnodes.com/claims/e/nvidia-tsmc-cowos-majority-share (accessed October 29, 2026).
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