Sourced evidence
NVIDIA estimated at ~60% of global CoWoS wafer demand for 2026
A Morgan Stanley estimate reported via 36Kr put NVIDIA's 2026 CoWoS (advanced chip packaging) wafer demand at roughly 595,000 units — about 60% of global CoWoS capacity — with TSMC producing the majority of that volume, mainly for NVIDIA's next-generation Rubin architecture.
- Type
- Research
- Published
- December 4, 2025
- Confidence
- 78/100
- Filed under
- NVIDIA
Supports these links
- NVIDIA relies on Taiwan Semiconductor Manufacturing Company
- NVIDIA relies on Advanced Semiconductor Packaging
Cite this
InsightNodes, "NVIDIA estimated at ~60% of global CoWoS wafer demand for 2026" (NVIDIA). Source: 36Kr (citing Morgan Stanley research), December 4, 2025, https://eu.36kr.com/en/p/3580962946874242. https://insightnodes.com/claims/e/nvidia-cowos-demand-share-estimate (accessed October 29, 2026).
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