Sourced evidence
NVIDIA relies on ASE Technology as a non-TSMC OSAT partner for CoWoS advanced-packaging capacity
TrendForce reporting describes ASE stepping up CoWoS-L/S advanced-packaging capacity (including its CoWoP process) as TSMC's own CoWoS lines are fully booked, with ASE serving as a structural overflow packaging partner for NVIDIA's GPU production.
- Source
- TrendForce
- Type
- Research
- Confidence
- 60/100
- Filed under
- NVIDIA
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Cite this
InsightNodes, "NVIDIA relies on ASE Technology as a non-TSMC OSAT partner for CoWoS advanced-packaging capacity" (NVIDIA). Source: TrendForce, https://www.trendforce.com/news/2025/12/08/news-tsmcs-cowos-l-s-reportedly-fully-booked-osat-partners-step-up-with-ases-cowop-in-focus/. https://insightnodes.com/claims/e/nvidia-ase-technology-cowos-osat-partner-2025 (accessed October 29, 2026).
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