Sourced evidence
Huawei Connect 2025 keynote: Ascend roadmap to 2028
Huawei rotating chairman Eric Xu (Sept 18, 2025): Ascend 950PR available Q1 2026; Ascend 950DT Q4 2026; Ascend 960 Q4 2027; Ascend 970 planned Q4 2028; self-developed HBM (HiBL 1.0 with 950PR; HiZQ 2.0 with 950DT, 144GB, 4 TB/s); Atlas 950 SuperPoD (up to 8,192 chips) Q4 2026; Atlas 960 SuperPoD (up to 15,488 chips) Q4 2027. Source extract: "The Ascend 950DT chip will be available in the fourth quarter of 2026."
- Source
- Huawei (newsroom)
- Type
- Company filing or release
- Published
- September 18, 2025
- Confidence
- 90/100
- Filed under
- NVIDIA
Cite this
InsightNodes, "Huawei Connect 2025 keynote: Ascend roadmap to 2028" (NVIDIA). Source: Huawei (newsroom), September 18, 2025, https://www.huawei.com/en/news/2025/9/hc-xu-keynote-speech. https://insightnodes.com/claims/e/nvidia-analyst-huawei-ascend-roadmap-2025 (accessed October 29, 2026).
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