Sourced evidence
NVIDIA books majority of TSMC CoWoS capacity, overflow to Amkor and ASE
NVIDIA is projected to book roughly 595,000 CoWoS-equivalent advanced-packaging wafers in 2026, with the bulk from TSMC and the remainder split across non-TSMC packaging partners Amkor and ASE Technology, making advanced packaging capacity a distinct supply-chain bottleneck alongside wafer fabrication.
- Source
- DigiTimes / CNBC
- Type
- News report
- Published
- December 10, 2025
- Confidence
- 70/100
- Filed under
- NVIDIA
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Cite this
InsightNodes, "NVIDIA books majority of TSMC CoWoS capacity, overflow to Amkor and ASE" (NVIDIA). Source: DigiTimes / CNBC, December 10, 2025, https://www.digitimes.com/news/a20251210PD218/tsmc-cowos-capacity-nvidia-equipment.html. https://insightnodes.com/claims/e/nvidia-amkor-cowos-overflow-2026 (accessed October 29, 2026).
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