Semiconductor Manufacturing
Kinsus Interconnect Technology
A Pegatron-affiliated IC substrate maker that supplies customers including NVIDIA and AMD, approving a US$744 million ABF (Ajinomoto Build-up Film) substrate capacity expansion in early 2026 on a three-year demand outlook; separately piloting a Penang, Malaysia facility as a manufacturing-diversification move, with initial trial production aimed at automotive, consumer-electronics and memory-chip customers rather than AI accelerators specifically.
Sources
Every claim traced to a primary source — evidence, recent activity, and insider filing behavior, all in one place.
Evidence
2 sources · 69% avg. source confidence
- Nikkei Asia — Taiwan's Kinsus mulls setting up chip substrate plant in Malaysia68% source confidence
- DigiTimes — Kinsus approves US$744M ABF expansion on clear three-year demand outlook70% source confidence
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The Story So Far (last 6 months)
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Kinsus Interconnect Technology's Timeline
A sourced, dated history of Kinsus Interconnect Technology's key moments — founding to present.
Jan 2024 · Begins Penang, Malaysia trial production
Kinsus rented a facility in Penang, Malaysia to begin trial production of the final testing/quality-control step of substrate manufacturing, targeting automotive, consumer-electronics and memory-chip customers as part of a broader diversification of manufacturing outside Taiwan and China.
Feb 2026 · Approves US$744M ABF substrate expansion
Kinsus approved a US$744 million expansion of its high-end ABF substrate capacity, citing a clear three-year demand outlook as high-end substrate supply is expected to remain tight through 2026.