Semiconductor Manufacturing
Disco Corp.
A Japanese equipment maker holding a dominant global share in wafer dicing and grinding tools, essential precision-cutting steps in chip manufacturing and advanced packaging that benefit directly from AI-driven demand for chiplets and 3D-stacked memory. Disco Corp, which holds an estimated 70-80% global market share in wafer dicing and grinding equipment, reached trailing 12-month revenue of $2.9 billion, with Q1 2026 revenue of ¥89.9 billion (about $838 million, up 8.6% year-over-year) beating consensus by nearly 27%.
Sources
Every claim traced to a primary source — evidence, recent activity, and insider filing behavior, all in one place.
Evidence
2 sources · 72% avg. source confidence
- SemiAnalysis / TradingView News — Disco Corp posts record FY2025 results on generative AI boom, holds 70-80% dicing/grinding share75% source confidence
- Meyka — Disco Q1 2026 revenue beats consensus by 27%, reaching ¥89.9 billion with zero debt68% source confidence
Dependency Map
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The Story So Far (last 6 months)
Auto-generated from this entity's dated milestones, relationship updates, and sourced evidence — not AI-written, just sorted.