Semiconductor Manufacturing
ASE Technology
The world's largest outsourced semiconductor assembly and test (OSAT) provider, absorbing overflow advanced-packaging demand that TSMC's CoWoS capacity cannot meet as AI chip demand strains the entire packaging supply chain. ASE is tripling its CoWoS-equivalent packaging capacity to 25,000 wafers per month with $7 billion in committed capex, and has raised advanced packaging quotes by more than 20% amid near-full capacity utilization, further lifting 2026 capex to $8.5 billion to expand CoWoS and Fan-Out Chip on Substrate capacity.
Leading Indicators
Hiring and patent filing trends — the underlying numbers Momentum is computed from. Insider filing activity is tracked separately under Sources below.
Sources
Every claim traced to a primary source — evidence, recent activity, and insider filing behavior, all in one place.
Evidence
4 sources · 1 government/SEC filing · 78% avg. source confidence
- U.S. Securities and Exchange Commission (EDGAR) — ASE Technology Holding FY2025 Annual Report (Form 20-F), filed with the SEC95% source confidence
- EE Times / DigiTimes — ASE boosts packaging capacity for NVIDIA, AMD and Amazon as TSMC outsources overflow demand62% source confidence
- FinancialContent — ASE becomes the indispensable second supply chain as TSMC's CoWoS capacity cannot meet AI demand75% source confidence
- TrendForce — ASE raises advanced packaging prices 5-20% in 2026 amid AI-driven capacity constraints80% source confidence
Insider Filing Activity
Direction/size reflects a sample of the most recent filings, not every Form 4 in the window · sourced from SEC EDGAR · as of Jul 28, 2026
Dependency Map
What ASE Technology depends on below, and who depends on ASE Technology above — click any node to make it the new center, 3 levels deep.
Connection type
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The Story So Far (last 6 months)
Auto-generated from this entity's dated milestones, relationship updates, and sourced evidence — not AI-written, just sorted.
ASE Technology's Timeline
A sourced, dated history of ASE Technology's key moments — founding to present.
Jan 1984 · Founded
ASE Technology was founded, later becoming the world's largest outsourced semiconductor assembly and test (OSAT) provider.
Jan 2026 · Tripling CoWoS-equivalent capacity
ASE committed $7 billion in capex to triple its CoWoS-equivalent packaging capacity to 25,000 wafers per month, absorbing overflow demand TSMC's own CoWoS lines could not meet, further lifting 2026 capex to $8.5 billion.
How These Connections Evolved
How a relationship changed over time, not just its current state — sourced, dated, and traceable.
ASE Technology ↔ Advanced Semiconductor Packaging
2024–2025
ASE scaled its FoCoS and CoWoS-equivalent outsourced advanced-packaging capacity to absorb overflow demand that TSMC's own CoWoS lines could not meet during the AI chip packaging bottleneck.
Now
ASE supplies outsourced advanced packaging capacity, including CoWoS-equivalent and FoCoS processes, absorbing overflow demand that TSMC's own CoWoS capacity cannot meet.